Fully automated SMT (Surface Mount Technology) production line equipment

Fully automated SMT (Surface Mount Technology) production line equipment

This is a fully automated SMT (Surface Mount Technology) production line system for the electronics manufacturing sector, encompassing the complete process from ‘loading → printing → inspection → sorting → soldering → cooling → optical inspection → board collection’. Through the coordinated operation of functional modules, it achieves automated production and quality control for electronic components such as PCB boards and chip modules.

Core Modules and Functional Analysis

Feeding and Printing Section

1.5KW Board Loader: Automated feeding equipment that batch-feeds electronic substrates (e.g., PCB boards) into the production line, replacing manual loading to enhance process efficiency.

2.5KW Screen Printer: Applies solder paste (or markings) onto substrate surfaces, establishing the foundation for subsequent component placement and soldering while ensuring printing precision and uniformity.

100W 0.6 Transfer Station: Connects the printer to downstream equipment, serving as a buffer and transfer point to maintain production line continuity.

Inspection and Sorting Section

1.5kW SPI (Solder Paste Inspection Equipment): Utilises optical technology to inspect post-printing solder paste metrics including thickness, coverage area, and uniformity, proactively mitigating soldering defect risks.

1.0 Sorting Machine: Performs preliminary substrate sorting, removing products with obvious cosmetic or dimensional non-conformities to reduce wasteful consumption in subsequent processes.

200W Buffer Station: Temporarily stores substrates awaiting processing, balancing production rhythms between preceding and subsequent stages to prevent line congestion or idle time.

100W Transfer Table: Bridges the buffer station and reflow oven, ensuring smooth substrate transfer into the soldering phase.

Soldering and Cooling Section

80KW Reflow Oven: Employing a thermal cycle of ‘heating → holding → cooling’ to melt and solidify solder paste, completing the bonding of electronic components to substrates. This constitutes the core soldering equipment in the SMT process.

1.0A Cooling Transfer Station: Cools post-soldering substrates to temperatures compliant with subsequent process requirements, preventing thermal deformation or performance degradation.

Optical Inspection and Board Collection Section

120W AOI + 1.5KW AOI: Two automatic optical inspection units conduct defect detection on post-weld substrates, examining appearance, solder joints, and component placement (e.g., cold solder joints, missed solder, component misalignment, polarity errors). Utilising high-precision

imaging and algorithmic recognition, this achieves ‘full inspection’ level quality control.

200W KDO Board Collector: Automated collection and sorting of qualified finished products, completing the final stage of the production line.

Engineering Drawing Information

Dimensions and Layout: The drawing specifies a total length of 18625mm, with clear module dimensions (e.g., 1375mm, 1200mm), reflecting the production line's compact layout and spatial planning.

Technical Parameters: Power ratings (e.g., 1.5KW, 80KW) are specified for each module, indicating energy consumption and power configuration.

The scale is 1:200, with the part drawing reference ‘Di Ji 20230404’, ensuring complete engineering traceability.

 Application Value

Through end-to-end automation and multi-stage high-precision inspection, this system facilitates the transition from labour-dependent to intelligent production in electronics manufacturing:

Efficiency Enhancement: Replaces manual operations, substantially reducing process time to accommodate mass production demands;

Quality Assurance: Achieves ‘zero-miss’ quality control through SPI, dual AOI and other inspection stages, reducing defect rates;

Cost Optimisation: Lowers labour costs and scrap losses, enhancing production economics and competitiveness.

Suitable for large-scale production and quality control of PCB boards and module products across consumer electronics, automotive electronics, industrial control and related sectors.