SMT intelligent surface mount technology (SMT) full-process production line (frame loading + printing + surface mount technology + reflow soldering type)

Product Description
This product is a set of SMT automated production line covering the entire process of PCB board loading, bare board assembly, printing, surface mount technology (SMT) placement, soldering and material cutting. Integrated core equipment such as material frame loading machine, bare board loading machine, printing machine, 0.5 docking table, SPI, surface mount technology (SMT) machine, pallet loading table, 1.0 inspection docking table, reflow soldering machine, 1.5 ball docking table, plate flipping machine, and material frame unloading machine. Through an intelligent control system, seamless interaction among all links is achieved, completing the fully automated operation of PCB boards from raw material loading to finished product unloading. This significantly enhances the efficiency and accuracy of electronic component mounting and soldering, and is suitable for the large-scale production of multiple types of PCB boards.

Product advantages
Full-process automation: From PCB board loading to finished product unloading, no human intervention is required, covering the entire process from loading, board assembly, printing, surface mount technology (SMT), inspection, soldering to unloading. Production efficiency is increased by more than 60%, reducing labor costs and quality risks.
Multi-device precise collaboration: Printers, SPI, surface mount technology (SMT) machines, reflow ovens and other equipment are efficiently connected through docking stations, ensuring a stable production cycle and meeting the placement requirements of high-precision components under 0.1mm.
Intelligent process control: The printing machine adopts closed-loop control technology. SPI is used to detect solder paste, and reflow soldering is equipped with an intelligent temperature control system to ensure the consistency and stability of printing, surface mount technology (SMT), and soldering quality.
Flexible production adaptation: The equipment parameters can be flexibly adjusted according to the PCB board specifications and component types, supporting both small-batch multi-variety and large-scale single-variety flexible production.

Product features
The board loading and unloading machines on the material frame realize the automatic storage and turnover of PCB boards, reducing manual handling.
The printing accuracy of the printing machine is ≤±0.02mm, which is suitable for the printing requirements of 01005 ultra-small components.
SPI has high detection accuracy, capable of identifying defects such as solder paste thickness, area, and offset, with a detection accuracy rate of ≥99.9%.
The surface mount technology (SMT) placement machine supports simultaneous operation of multiple suction nozzles, with a placement accuracy of ≤±0.02mm, and is compatible with various SMT components.
Reflow soldering adopts zoned precise temperature control, with a temperature control accuracy of ±1℃ and a soldering yield of ≥99.5%.

Application scenarios
The large-scale production of PCB surface mount soldering in the electronics manufacturing industry, such as the production workshops of consumer electronics, automotive electronics, industrial control boards, medical electronics and other products, is particularly suitable for enterprises with high requirements for mounting accuracy and production efficiency.