SMT full-process intelligent surface mount welding production line (loading board + printing + SPI + surface mount + reflow soldering + AOI + unloading board)

Product Description
This product is an SMT automated production line that covers the entire process of PCB board loading, printing, solder paste inspection, surface mount technology (SMT) placement, soldering, inspection, and unloading. It integrates core equipment such as board loading machines, docking stations, printers, SPI, SMT placement machines, reflow ovens, AOI, and unloading machines. Through an intelligent control system, seamless interaction among all links is achieved, completing the fully automated operation of PCB boards from raw material loading to finished product unloading. This significantly enhances the efficiency and accuracy of electronic component mounting and soldering, and is suitable for the large-scale production of multiple types of PCB boards.

Product advantages
Full-process automation: From PCB board loading to finished product unloading, no human intervention is required, covering the entire process from loading, printing, solder paste inspection, surface mount technology (SMT) placement, soldering, inspection to unloading. Production efficiency is increased by more than 60%, reducing labor costs and quality risks.
Multi-device precise collaboration: Printers, SPI, surface mount technology (SMT) machines, reflow ovens, AOI and other devices are efficiently connected through docking stations, ensuring a stable production cycle and meeting the placement requirements of high-precision components under 0.1mm.
Intelligent process control: The printing machine adopts closed-loop control technology. SPI enables three-dimensional detection of solder paste. Reflow soldering is equipped with an intelligent temperature control system. AOI ensures full inspection of defects after soldering, guaranteeing the consistency and stability of quality at each stage.
Flexible production adaptation: The equipment parameters can be flexibly adjusted according to the PCB board specifications and component types, supporting both small-batch multi-variety and large-scale single-variety flexible production.

Product features
The board loading machine and the board unloading machine achieve automated loading and unloading of PCB boards, reducing manual handling.
The printing accuracy of the printing machine is ≤±0.02mm, which is suitable for the printing requirements of 01005 ultra-small components.
SPI adopts 3D detection technology, which can identify defects such as solder paste thickness, area and offset, with a detection accuracy rate of ≥99.9%.
The surface mount technology (SMT) placement machine supports simultaneous operation of multiple suction nozzles, with a placement accuracy of ≤±0.02mm, and is compatible with various SMT components.
Reflow soldering adopts zoned precise temperature control, with a temperature control accuracy of ±1℃ and a soldering yield of ≥99.5%.
AOI equipment features micron-level detection accuracy, capable of identifying welding defects such as false soldering, bridging, and missing components, with a detection accuracy rate of ≥99.9%.

Application scenarios
The large-scale production of PCB surface mount soldering in the electronics manufacturing industry, such as the production workshops of consumer electronics, automotive electronics, industrial control boards, medical electronics and other products, is particularly suitable for enterprises with high requirements for mounting accuracy, production efficiency and quality inspection.