Full-process SMT (Surface Mount Technology) automated production line equipment

Full-process SMT (Surface Mount Technology) automated production line equipment

Equipment Composition and Functionality

Loading and Pre-processing Stage

PCB Unboxing and Loading Machine: Automated unboxing and feeding of PCB boards, supplying initial materials to the production line.

Pre-AOI Inspection Machine: Performs optical inspection of PCB boards prior to placement, identifying defects such as board flaws and pad anomalies to intercept non-conforming items early.

0.6 Waste Paper Collection Station: Complements pre-processing equipment by collecting waste paper or scrap tape generated during production, maintaining production line tidiness.

Placement and Soldering Process

Multiple Placement Machines: Utilise high-precision vision systems to pick resistors, capacitors, chips and other components, placing them accurately onto PCB pads. Multiple placement machines shown working in tandem can simultaneously handle diverse placement requirements (small components, irregularly shaped components), enhancing production efficiency.

2.0 Placement Conveying: Ensures stable PCB transfer between multiple placement machines, maintaining continuous placement workflow.

Dual-track Reflow Oven: Utilises multi-zone heating (preheating, reflow, cooling) to melt and solidify solder paste, achieving permanent component-to-PCB bonding; the ‘dual-track’ design processes PCBs from two production lines simultaneously, significantly boosting output capacity.

Inspection and Unloading Section

Post-AOI Inspection Machine: Performs optical inspection on PCBs post-soldering to identify defects such as cold solder joints, bridging, and component misalignment, ensuring product quality.

0.8 Paper Feeder, Lifting Mechanism, and Conveyor Belt: Coordinates with inspection equipment to unload, sort (good/defective), and transport PCBs, achieving automated end-of-line collection.

Production Line Features

Fully Automated Process: From PCB loading, pre-inspection, placement, soldering to post-inspection and unloading, all stages operate without manual intervention, substantially boosting production efficiency and product consistency.

High Precision and High Throughput: The placement machine features micron-level positioning accuracy, capable of handling 01005 ultra-micro component placement. Dual-track reflow ovens and multiple placement machines work in tandem, suited for large-scale mass production scenarios (e.g., batch manufacturing of mobile phone and tablet motherboards). .

End-to-End Quality Assurance: A dual AOI inspection mechanism combining pre-inspection and post-inspection ensures product quality control at both the source and final stages, minimising the risk of defective products entering the supply chain.

This production line is suitable for large-scale SMT manufacturing in sectors such as consumer electronics and automotive electronics. It efficiently completes the entire automated PCB placement and soldering process, serving as core equipment for achieving intelligent, large-scale production in the electronics manufacturing industry.