SMT (Surface Mount Technology) Inspection and Soldering Integrated Equipment Combination

SMT (Surface Mount Technology) Inspection and Soldering Integrated Equipment Combination

Equipment Composition and Functionality

AOI Inspection Unit

AOI Equipment: Utilises a high-definition optical system to perform fully automated inspection of post-soldering PCB boards, accurately identifying defects such as solder joint defects, component misalignment, and missing components. This serves as the critical quality assurance equipment for SMT product quality.

800×800 Workbench: Provides a stable mounting and operating platform for the AOI equipment, optimising the rationality of equipment layout.

0.59 Transfer Basket Station: Automates PCB transfer between inspection and soldering stations, ensuring process continuity.

Soldering Unit

Dual-Track Reflow Oven: Melts and solidifies solder paste through multi-zone heating (preheat, reflow, cool), achieving reliable component-to-PCB bonding. The ‘dual-track’ design processes PCBs from two production lines simultaneously, significantly boosting efficiency.

Production Line Features

High Inspection Accuracy: AOI equipment employs high-precision optical recognition technology to detect micron-level soldering defects, meeting stringent soldering quality requirements in consumer electronics, automotive electronics, and other demanding sectors.

Efficient Process Integration: Fully automated transition from soldering to inspection via transfer mechanisms reduces manual intervention, enhancing production efficiency and inspection consistency.

Strong Modular Adaptability: Each device functions independently yet can be flexibly combined. The number of AOI units and reflow oven specifications can be adjusted according to production line scale, adapting to diverse manufacturing scenarios.

This integrated equipment suite serves the core process segments of SMT production lines, providing a unified solution for soldering and quality inspection of electronic PCBs. It finds extensive application in the mass production of electronic products including mobile phones, computer motherboards, and industrial control boards.