Einzelheiten zum Produkt
Herkunftsort: Shenzhen China
Markenname: KUTEDE
Zertifizierung: ISO
Modellnummer: KTD-081
Zahlungs- und Versandbedingungen
Min Bestellmenge: 1 Satz
Preis: Verhandlungsfähig
Verpackung Informationen: Zubehör separat gepackt
Lieferzeit: 30 Arbeitstage nach Erhalt der Anzahlung (die tatsächliche Vorlaufzeit entsprechend der Menge)
Zahlungsbedingungen: T/T
Versorgungsmaterial-Fähigkeit: 1 Sätze pro Mund
PCB -Richtung: |
Lr/rl |
PCB-Höhe: |
900 ± 20 mm |
Größe: |
individuell angepasst |
PCB -Richtung: |
Lr/rl |
PCB-Höhe: |
900 ± 20 mm |
Größe: |
individuell angepasst |
Product Description
This product is a multi-module flexible SMT automated production line, integrating core equipment such as a 0.6 micro board loading machine, a printing machine, a 0.5 docking station, a placement machine, a 4.5-meter flat transfer machine, a 0.8 double-track docking station, a double-track reflow soldering machine, and a 1500 flow branch. It adopts a layout design of multiple printing-placement units + double-track reflow soldering machines. It can flexibly start single-module or multi-module operations according to production capacity requirements, achieving full-process automation of PCB boards from multi-batch feeding, printing, surface mount technology to double-track soldering, and meeting the flexible production needs of small-batch multi-variety and large-scale single-variety.
Product advantages
Flexible switching of multiple modules: Supports single module (single print-surface mount unit) or parallel production of multiple modules. When changing production, module parameters are automatically called, and the change time is ≤15 minutes, meeting the flexible production requirements of multiple varieties.
Dual-track high-efficiency soldering: The dual-track reflow soldering design doubles the soldering capacity, increases space utilization by 40%, and can handle PCB boards of different specifications simultaneously, making it suitable for large-scale mass production.
Multi-device precise collaboration: Printers, surface mount technology (SMT) machines, flatbed transfer machines, and double-track reflow ovens are efficiently connected through docking stations, ensuring a stable production cycle and suitability for high-precision component mounting under 0.1mm.
Intelligent process control: Each module and dual-track reflow soldering are linked through a central control system to monitor production progress and equipment status in real time, achieving dynamic capacity allocation.
Product features
The 0.6 micro board loading machine is suitable for small-batch PCB board loading with multi-module layout, featuring strong flexibility.
The printing accuracy of the printing machine is ≤±0.02mm, and it supports multi-module synchronous printing.
The surface mount technology (SMT) placement machine supports multi-nozzle operation, with a placement accuracy of ≤±0.02mm, and is compatible with various SMT components.
The double-track reflow soldering adopts zoned precise temperature control, with a temperature control accuracy of ±1℃ and a soldering yield of ≥99.5%.
The 1500 flow branch realizes the automated flow of PCB boards after welding, reducing manual intervention.
Application scenarios
The multi-variety flexible SMT production in the electronics manufacturing industry, such as the flexible switching scenarios of consumer electronics R&D and sampling, small-batch customized production, and large-scale mass production, is particularly suitable for enterprises with high requirements for the balance between production flexibility and efficiency.
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