Dual-track parallel SMT (Surface Mount Technology) automated production line equipment

Dual-track parallel SMT (Surface Mount Technology) automated production line equipment

Equipment Composition and Functionality

Loading and Printing Stage

U-shaped Loading Machine, L-shaped Unloading Machine: Responsible for PCB loading and unloading respectively, enabling automated board conveyance.

Printing Machine: Precisely deposits solder paste onto PCB pads, laying the foundation for subsequent placement operations.

1.0 Transfer Station: Complements the printer and pick-and-place machines, ensuring precise handover and transfer of PCBs between equipment.

Placement Process

Multiple Pick-and-Place Machines: Utilise high-precision vision systems to pick resistors, capacitors, chips and other components, placing them accurately onto PCB pads. Multiple machines operate in parallel, simultaneously handling placement requirements for different types (small components, irregularly shaped components), significantly boosting production efficiency.

Soldering and Post-Processing Stage

4.5-metre Transfer Machine, 0.64-metre Dual-Track Transfer Basket Station: Facilitates PCB transfer and handover between dual-track production lines, ensuring synchronisation of the dual-track process.

Dual-Track Reflow Oven: Utilises multi-zone heating (preheating, reflow, cooling) to melt and solidify solder paste, completing component-to-PCB bonding; The ‘dual-track’ configuration enables simultaneous processing of PCBs from two production lines, doubling throughput capacity.

Compact Dual-Track Board Collector: Automates the collection of finished PCBs, completing material retrieval at the production line's end.

Production Line Features

Dual-Track Parallel Operation for High-Volume Efficiency: The dual-track design enables synchronous operation of two production lines,

substantially increasing output per unit time. This configuration is ideally suited for large-scale mass production scenarios such as consumer electronics (e.g., batch production of mobile phone motherboards).

Fully Automated Process: From PCB loading, solder paste printing, component placement to reflow soldering and board collection, all stages operate without manual intervention, ensuring production efficiency and product consistency.

High Precision Assurance: The placement machine achieves micron-level positioning accuracy, accommodating 01005 ultra-micro component placement; dual-track reflow ovens deliver precise temperature zone control, guaranteeing soldering quality.

This production line represents exemplary equipment for achieving scaled, intelligent manufacturing within the electronics industry. Suitable for SMT production of consumer electronics such as mobile phones, tablets, and smart hardware, its dual-track parallel design maximises production efficiency while ensuring product quality stability through fully automated processes.