Surface Mount Technology (SMT) production line equipment

Surface Mount Technology (SMT) production line equipment

Equipment Composition and Functionality

Solder Paste Printing Stage

0.8 Model Loader: Automated feeding of PCB boards into the printing process.

1.2 Printing Machine: Precisely deposits solder paste onto PCB pads via a stencil, preparing for subsequent placement.

0.6 Waste Paper Collection Station: Complements the printing machine by collecting waste paper generated during printing, maintaining a tidy

production environment.

Placement Process

Placement Machine:

Core equipment utilising a vision positioning system to pick up electronic components such as resistors, capacitors, and chips, precisely placing them onto PCBs with printed solder paste. Multiple placement machines are shown to accommodate different component types (e.g., small components, irregularly shaped components).

Placement Light:

Provides auxiliary illumination for the placement machine's vision system, ensuring accuracy in component recognition and positioning.

1.0 Waste Paper Collection Station: Complements the placement machine by collecting waste tape or paper generated during the placement process.

0.6 Top Plate Waste Paper Collection Station: Assists in collecting waste materials from the placement stage, enhancing production line tidiness.

Soldering and Post-Processing Stage

4.5 Transfer Machine: Transfers PCBs with placed components from the placement area to the conveyor track for the soldering stage.

Dual-track Reflow Oven: Utilises multi-zone heating (preheat, reflow, cool) to melt and solidify solder paste, achieving permanent component-to-PCB bonding; the ‘dual-track’ design processes PCBs from two production lines simultaneously, boosting efficiency.

The elongated equipment on the right serves the cooling or inspection stage, facilitating post-soldering PCB cooling/setting or quality checks (e.g., AOI automatic optical inspection).

Production Line Features

High Automation: Fully automated workflow from PCB loading, solder paste printing, component placement to reflow soldering, minimising manual intervention while enhancing production efficiency and consistency.

Modular Layout: Independently functional yet seamlessly integrated equipment allows flexible line configuration adjustments based on production requirements (e.g., adding placement machines, swapping reflow ovens of different specifications).

High-Precision Assurance: Both printers and placement machines feature micron-level positioning accuracy, guaranteeing placement quality for ultra-micro components such as 01005s. This meets production requirements for high-end sectors including consumer electronics and automotive electronics.

This production line is suitable for large-scale electronic component placement manufacturing, efficiently completing the SMT manufacturing process for products such as mobile phone motherboards, computer graphics cards, and industrial control boards.